Dynasolve 185

Dynasolve 185

Restricted use. Please contact us if you are interested in this product.

Amine-cured Epoxy Cleaning Solvent

Dynasolve 185 is a formulated solvent used to remove amine-cured epoxy systems in both electronic and industrial applications. It contains a proprietary blend of ingredients that facilitate polymer removal and prevent the depositing of particles back onto a part.

Cleaning Application:

  • Depotting and decapsulating of electronic components.
  • Industrial epoxy removal and cleaning.


  • More efficient than acetone, MEK & other solvents
  • Formulated to be highly selective
  • No chlorinated, acidic or caustic components
  • High resin loading capacity allows for reuse and reduced cost of ownership
  • High flash point

Materials Removed:

  • Amine-cured epoxy
  • Many types of inks
  • Acrylic emulsions

Product usage guidelines

  1. Heat Dynasolve 185 to 200°F (93°C) and immerse part.
  2. Observe carefully. If epoxy appears unaffected after 1 hour, increase temperature to 250° - 300°F (121° - 148°C)
  3. After successful removal of epoxy, rinse with alcohol or water.
  4. If epoxy appears unaffected after 2 hours, call for technical support.

Material Compatibility:

Recommended materials including:

  • All metals
  • Teflon
  • Polyethylene & polypropylene

Avoid materials including:

  • Viton
  • PVC
  • Acrylic


Specific gravity: 1.04

Boiling point: >369°F (>187°C)

Flash point: 207°F (97°C)

Packing Size:

1 Gallon Bottle