Dynasolve 230

Dynasolve 230

Restricted use. Please contact us if you are interested in this product.

Cured Silicone Cleaning Solvents

The Dynasolve 200 series solvents are reactive formulated solvents which are used to remove cured silicones in both electronic and industrial applications. The four products vary based on aggression level and flash point, so the best product for a given application depends on the desired balance of aggression and flash point.

Cleaning Applications:

  • Depoting and decapsulating electronic components
  • Conformal coating removal
  • Industrial silicone removal and cleaning


  • More efficient than acetone, MEK & other solvents
  • Formulated to be highly selective
  • Non-chlorinated
  • Ability to use at room temperature
  • High resin loading capacity allows for reuse and reduced cost of ownership

Product Usage Guidelines

  1. Ensure the part is completely free of water.
  2. Immerse part in Dynasolve 200 Series solvent.
    - Dynasolve 220, 225 and 230 should be used at room temperature.
    - Dynasolve 218 should be used at 125°F (52°C)
  3. Once cured silicone has been removed, it is critical to rinse with alcohol prior to rinsing with water,
  4. Observe carefully. If silicone is unaffected by Dynasolve 200 series solvent after 4 hours, call for technical support.

Material Compatibility

Recommended materials including:

  • All metals
  • Teflon
  • Polyethylene & Polypropylene

Avoid materials including:

  • Nylon
  • PVC
  • Do not immerse in aluminium for more than 8 hours

Materials Removed:

  • Conformal coatings
  • Encapsulants/potting compounds
  • RTVs
  • Industrial silicones

Packing Size:

1 Litre Bottle
1 Gallon Bottle

  Dynasolve 230
Aggression level High
Flash Point 18°F (-7°C)
Usage Temp Room Temp
Boiling Point >200°F (>93°C)
Specific Gravity 0.31